Simulación por elementos finitos del ensayo Transverse Tensile Bundle Test en materiales compuestos.
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Date
2025
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Universidad de Concepción
Abstract
En el presente trabajo se ha desarrollado un modelo numérico basado en el método de elementos finitos para simular el ensayo Transverse Tensile Bundle Test (TTBT) en materiales compuestos, con el objetivo de evaluar la distribución de esfuerzos y el comportamiento mecánico en la interfaz fibra-matriz . Este estudio responde a las limitaciones de los ensayos en microescala, como la complejidad de la fabricación de probetas, los altos costos y el equipamiento especializado . La metodología incluyó la fabricación de probetas conforme a la norma ASTM D638, el uso del sistema de correlación de imagen digital (DIC) Aramis para la medición de deformaciones, y la implementación de un modelo numérico en ANSYS Workbench utilizando el Cohesive Zone Model (CZM) para simular la fractura . Las propiedades de los materiales se obtuvieron a partir de ensayos experimentales y literatura especializada. El modelo fue validado comparando los resultados simulados con datos experimentales, logrando una buena concordancia . Los resultados de la simulación micromecánica permitieron identificar que la falla se inicia en los extremos de la hebra de fibra, donde se concentran los esfuerzos, coincidiendo con lo expuesto en la literatura. El valor obtenido para el esfuerzo normal interfacial (INS) fue de 20.3 [MPa], un rango coherente con los valores reportados en la literatura y que representa aproximadamente entre un 10% y 15% del esfuerzo cortante interfacial (IFSS) típico. Se concluye que la metodología propuesta es una alternativa viable para caracterizar la adhesión en la interfaz a mesoescala, ofreciendo ventajas en términos de costo, tiempo y simplicidad experimental.
In this work, a numerical model based on the finite element method was developed to simulate the Transverse Tensile Bundle Test (TTBT) in composite materials, aiming to evaluate stress distribution and mechanical behavior at the fiber-matrix interface . This study was motivated by the experimental limitations of microscale tests, such as complex specimen preparation, high costs, and the need for specialized equipment . The methodology involved fabricating specimens based on the ASTM D638 standard, using the digital image correlation (DIC) system Aramis to measure deformations, and the implementation of a numerical model in ANSYS Workbench with the Cohesive Zone Model (CZM) to simulate fracture . Material properties were determined from experimental tests and specialized literature . The model was validated by comparing simulated results with experimental data, showing good agreement. The micromodel simulation results identified stress concentrations at the fiber ends, associated with the onset of interfacial debonding. The estimated interfacial normal stress (INS) value was 20.3 [MPa], which is consistent with literature and represents approximately 10% to 15% of typical interfacial shear stress (IFSS) values. It is concluded that the proposed methodology is a viable alternative for the mesoscale characterization of fiber-matrix adhesion, offering advantages in cost, time, and experimental simplicity.
In this work, a numerical model based on the finite element method was developed to simulate the Transverse Tensile Bundle Test (TTBT) in composite materials, aiming to evaluate stress distribution and mechanical behavior at the fiber-matrix interface . This study was motivated by the experimental limitations of microscale tests, such as complex specimen preparation, high costs, and the need for specialized equipment . The methodology involved fabricating specimens based on the ASTM D638 standard, using the digital image correlation (DIC) system Aramis to measure deformations, and the implementation of a numerical model in ANSYS Workbench with the Cohesive Zone Model (CZM) to simulate fracture . Material properties were determined from experimental tests and specialized literature . The model was validated by comparing simulated results with experimental data, showing good agreement. The micromodel simulation results identified stress concentrations at the fiber ends, associated with the onset of interfacial debonding. The estimated interfacial normal stress (INS) value was 20.3 [MPa], which is consistent with literature and represents approximately 10% to 15% of typical interfacial shear stress (IFSS) values. It is concluded that the proposed methodology is a viable alternative for the mesoscale characterization of fiber-matrix adhesion, offering advantages in cost, time, and experimental simplicity.
Description
Tesis presentada para optar al título de Ingeniero/a Civil Mecánico/a.
Keywords
Materiales Análisis, Micromecánica